Here’s what the iPhone 13 Pro teardown revealed

The Apple iPhone 13 Pro was recently dismantled in an investigative move by teardown specialist iFixit to deduce some relevant information about the phone which Apple probably will never disclose. Upon the teardown, iFixit say that they found several hidden details. Here’s what they claim to have found beneath the surface, quite literally.
As per the report, there is a new Face ID array inside the iPhone which combines the flood illuminator and the dot protector into one single unit and has helped make the notch smaller in the new iPhone. As per the teardown claim, the notch on the iPhone 13 Pro is about 20% smaller than that on the 12 Pro due to the merging of the flood illuminator and the dot projector into a single unit. Also, the earpiece speaker has been shifted from the notch to the top bezel.
Next, they have mentioned that the dot projector in the selfie shooter has “moved from the edge to the center of the module this year.”. They added that any display replacement would “knock out” the FaceID.
“Face ID works even when we disconnected the front sensor assembly. However, any display at replacement knocks out Face ID. We tried transferring the sensors from the old display and porting over the Face ID hardware, but no dice. It looks like the display is serial-locked to the phone.”
With the teardown, they also claimed that Apple might have put a new touch-integrated OLED panel this year in the iPhone 13 Pro. A touch-integrated OLED panel reduces the cost and the materials involved by combining the touch and the OLED layers in the display.
Coming to the logic board, the teardown reveals that the layered logic board is “even teensier” this year, and the SIM card reader is now “baked onto the board”. It claims that the following chips are there on the board: “Apple APL1W07 A15 Bionic SoC layered with what’s most likely 6 GB of SK Hynix LPDDR4X SDRAM, Apple/USI U1 ultra-wideband chip, Apple APL1098 power management IC, Skyworks SKY58276-17 front-end module, Skyworks SKY58271-19 front-end module, Apple 338S00770-B0 power management IC and STMicroelectronics STB601A05 power management IC.”

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